Recently I removed an i5-760 cpu to replace the board and noticed when removing the thermal compound (artic silver 5) that it almost completely hardened on both the cpu and the heatsink, like most of the moisture was removed from the product, it came off in pieces rather than the way I am used to removing it being in almost the same viscosity as when it was applied.
The positive side was that it was easy to remove.
It was in a computer that was built less than a year ago.
Has anyone ever seen this?

Reply With Quote
