I'm preparing to replace the dreaded stock heatsink with something that doesn't suck
I have some basic questions, and would appreciate the help.
I have already picked out and ordered my new heatsink (CM Hyper 212+) . I'm expecting it in the morning. I've already done lots of research on how to do everything properly and I think i'm ready. My questions are based on all of the conflicting opinions on this subject.
My main question is about applying thermal compound. I have found a set of videos online comparing various application methods using a clear piece of glass or plastic to simulate how the compound is spreading under pressure. http://youtu.be/EyXLu1Ms-q4
I realize its old and cheesy and not the best way to show this, but still helpful.
So based on what i saw i've settled with two methods that seem to actually work. I would like to know simply: Pea size OR Rice size?
Also how much do i need to worry about filling in the gaps on the heat spreader of the CM Hyper 212+???
Is it really that big a deal if i use q-tips to clean the old compound?
I realize that there is a possibility of leaving lint behind, but if i pay attention and actually look before applying the new compound, what are the risks?
Yes, i already have 90%+ isopropyl alcohol