In recent years, overclocking and material are the major positioning route in the middle and high-level MB market.
With the Desktop market changing, the terms like electric competition or Gaming appear on the technical data of a lot of hardware.
For the MB field with mature specifications, it has put the focus on the audio effect and network.
In this way, it intends to improve the traditional design model before, providing better audio effect for users in gaming environment.
Most customers are under the impression that BIOSTAR take the affordable price and the overclocking as the major market positioning.
TZ77XE4 released before performs well in the aspects of C/P ratio and overclocking capabilities.
And Hi-Fi Z77X released lately, as implied in the product name, mainly strengthens the audio effect.
The product package this time takes the sound-related pattern, which is also quite special.
Hi-Fi Z77X Appearance
Currently, most MB brands use the shining black PCB, while BIOSTAR uses the matte PCB material which increases the sense of texture.
As for colors of Hi-Fi Z77X, PCB, DRAM and PCI slots are all black, and then matched with blue radiator.
Hi-Fi Z77X looks different from the black and orange appearance of TZ77XE4. Personally, I like its external package design and new colors better.
Product manual, IO board, SLI / CorssFire X bridge, SATA wires, Calibration Microphone and driver disk
The lower-left section of motherboard
2 X PCI-E X16 3.0, supporting AMD CrossFireX/nVIDIA SLI technology at most, with a bandwidth of X8 + X8
1 X PCI-E X16 2.0, with a bandwidth of X4
3 X PCI-E X1
Network chip adopts Realtek RTL8111E
Audio chip Realtek ALC898 supports 8-channel Blu-ray Audio and THX TruStudio Pro technology at most
The lower-right of motherboard
2 X black SATA, provided by chipset Z77, with SATA3 specification
4 X black SATA, provided by chipset Z77, with SATA2 specification
They can work together to build RAID 0, RAID 1, RAID 5 and RAID 10, and the highest performance depends on the SATA device installed.
Power / Reset buttons and debug LED, and the black section on upper side is the front USB 3.0 slot
The upper -right of motherboard
4 X DIMM DDR3, supporting 1066/1333/1600/1866(OC)/2133(OC)/2400(OC)/2600(OC)
The maximum capacity supported by DDR3 is 32GB, supporting Extreme Memory Profile technology.
The lower side is the 24-PIN power input.
The upper-left of motherboard
The power supplies on both sides of CPU are equipped with the enhanced passive radiator, with a power input on the upper side of 8PIN.
1 X PS/2 Keyboard
1 X D-Sub / DVI-D / HDMI DisplayPort
4 X USB 2.0(black)
2 X USB 3.0(blue)
1 X RJ-45 Network hole
6 X Audio hole
The power supply design has 13 phases in total, including 10 CPU VCORE phases + 1 VCC phase + 2 IGD phases